NEWS GaN HEMT FOUNDRY PROCESS
UKRI support for 200mm Gallium
Nitride HEMT foundry process
UKRI SUPPORTS THE CSC AND NEWPORT WAFER FAB IN DEVELOPING A 200MM
GALLIUM NITRIDE HEMT FOUNDRY PROCESS. NEIL TYLER REPORTS
UKRI has announced support for the Compound
Semiconductor Centre (CSC) and Newport Wafer
Fab (NWF) in developing a 200mm Gallium Nitride
HEMT foundry process.
The project is a co-ordinated effort by CSC
and NWF to deliver a foundry grade 650V
GaN-on-Silicon HEMT process on a 200mm
wafer platform. The HEMT fabrication process
technology will leverage 30 years of Silicon
Power device manufacturing heritage at Newport
Wafer Fab, developed under an automotive (IATF
16949) quality accredited volume manufacturing
environment. The epitaxial solution will look to
leverage IP developed by CSC in partnership with
its parent company IQE, on a high volume Aixtron
G5 200mm manufacturing platform at its Cardiff,
UK facility. CSC recently achieved full ISO9001
accreditation of its internal Quality Management
System covering development through to volume
scale up. The project is supported by UKRI under
the ‘Automotive Transformation Fund: moving the
UK automotive sector to zero emissions’.
Commenting Sam Evans, NWFs Director of
External affairs, said,”This is an exciting step
towards NWFs vision of becoming a major
manufacturer of Compound-on-Silicon products.
We see the Wide Bandgap Power device market
as an excellent area to address in our plans to
expand our current manufacturing footprint of
8,000 wafer starts per week to 14,000, and it’s
a natural opportunity for us to pursue given our
heritage in high power Silicon MOSFET, IGBT and
GaN device development manufacturing.”
Rob Harper, GaN programme manager at CSC
added, “The GaN Power market is estimated to be
worth over $700m by 2025 with massive future
growth opportunity for EV adoption, and we are
collaborating with a global power semiconductor
blue-chip to help steer the process roadmap.
“We are initially targeting the EV segment of
the market including traction inverters; as the
project progresses we hope to roll out custom
foundry offerings that address additional market
segments including mobile/laptop fast chargers
and energy storage inverters.”
Accelerating embedded software compliance
LDRA has partnered with PTC to reduce the cost of compliance for critical embedded software
developers who are required to adhere to functional safety and security standards.
The integration between the LDRA tool suite and PTC’s Windchill RV&S provides the capability
to perform bidirectional traceability, standards compliance, and automated software quality analysis
and verification throughout the development lifecycle, saving both time and money for developers
who need to demonstrate compliance.
Ian Hennell, Operations Director, LDRA said, “Through this partnership, enterprise customers can
quickly link the Windchill RV&S artifacts into the software quality and verification workflow.”
From a workflow perspective, developers use Windchill RV&S to manage requirements, test
cases, and code. The LDRA tool suite links those requirements to the software analysis and
verification process to help identify and eliminate software flaws and vulnerabilities.
Developers can use both in-depth static and dynamic code analysis to verify the code, including
checking for coding standards compliance such as MISRA and/or CERT compliance, as well as
structural coverage analysis. They can also perform automated test case generation and execution
on the code within the LDRA tool suite and feed the results of those tests into Windchill RV&S to
achieve bidirectional linkage and traceability.
This combined solution automates software analysis and verification and provides bidirectional
traceability from requirements to source code, to the analysis and verification results. It also
enables rapid impact analysis and regression testing, which shortens the time to response and
reduces development and verification costs.
Editor Neil Tyler
neil.tyler@markallengroup.com
Contributing Chris Edwards, Charlotte Hathway,
Editors John Walko
editor@newelectronics.co.uk
Art Editor Chris Charles
chris.charles@markallengroup.com
Illustrator Phil Holmes
Sales Manager James Creber
james.creber@markallengroup.com
Publisher Peter Ring
peter.ring@markallengroup.com
Managing Jon Benson
Director jon.benson@markallengroup.com
Production Nicki McKenna
Manager nicki.mckenna@markallengroup.com
New Electronics editorial advisory panel
Trevor Cross, chief technology officer, Teledyne e2v
Pete Leonard, electronics design manager, Renishaw
Pete Lomas, director of engineering, Norcott Technologies
Neil Riddiford, principal electronics engineer, Cambridge
Consultants
Adam Taylor, embedded systems consultant
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