NEWS EYE TRACKING SOLUTION
3D ToF sensor-based
eye-tracking solution
EYEWARE AND MELEXIS COLLABORATE ON EYE TRACKING SOLUTION FOR DRIVER
MONITORING SYSTEMS. NEIL TYLER REPORTS
Eyeware, a Swiss 3D eye-tracking technology company and
Melexis have joined forces to create an advanced driver
monitoring system (DMS).
The DMS leverages Eyeware’s attention-monitoring
technology and uses Melexis’ MLX75027 3D Time-of-flight
sensors with VGA resolution, to enable robust eye gaze and
head tracking for in-cabin driver monitoring, even in sunlight.
Eyeware uses 3D time-of-flight cameras to overcome
the limitations of infrared-based tracking technology. The
company’s algorithms, using proprietary strategies based on
data-driven machine learning approaches, make it applicable in systems using low power, costeffective
and compact sensors.
“This collaboration demonstrates the robustness and wider range of head movements that
can be achieved using ToF technology, compared with current driver monitoring systems,” said
Gualtiero Bagnuoli, Product Marketing Manager, Melexis. “Our MLX75027 3D time-of-flight sensor
with VGA resolution, employs a high modulation frequency (20-100MHz) to drive the IR illumination
which means the sensor is almost completely unaffected by light, even under changing conditions.”
The range data provided by the 3D time-of-flight sensor is used to enhance the reliability of the
head and gaze tracking capabilities of the system, enabling it to monitor a very wide range of head
movements. The VGA 3D ToF sensor requires a minimal footprint, allowing it to be easily integrated
into the rear-view mirror assembly.
“Although the resolution is lower than current driver monitoring cameras, the DMS needs just
one sensor to track both driver and passenger,” explained Bagnuoli.
Video enhancement
technology developed Silicon Labs has entered into an agreement
IMINT Image Intelligence, a specialist in video
enhancement software, has joined forces with
Qualcomm to develop a new generation of
video enhancement solutions that leverage the
latest in AI and machine learning.
In addition to AI-based video enhancement
solutions, they are also working to upgrade
Imint’s existing suite of Vidhance smartphone
solutions with a new technology that
significantly reduces the amount of power that
each requires. The power-efficient Vidhance
solutions have been optimised for use on
Qualcomm’s Snapdragon 865 Mobile Platform.
The first results of the collaboration are now
available with Imint’s Vidhance Selfie Mode
solution, leveraging Qualcomm’s high-accuracy
hardware, keeping smartphone users in the
video frame even when they’re moving.
They have also developed a “power
consumption reduction” technology that
is capable of reducing the power required
to process video using Vidhance solutions
significantly, while accelerating video rendering.
Silicon Labs’ IoT acquisition
with Redpine Signals to acquire the company’s
Wi-Fi and Bluetooth business.
The acquisition, said to be costing Silicon
Labs $308million, will include Redpine’s
development centre in Hyderabad, India, and
the company’s extensive patent portfolio.
“The acquisition of Redpine Signals’
ultra-low-power Wi-Fi and Bluetooth products
and extensive IP portfolio will expand our
leadership in IoT wireless technology,” said
Tyson Tuttle, CEO of Silicon Labs. “The
addition of these products will drive further
momentum in the smart home, industrial IoT
and commercial markets.”
Wi-Fi 6 (802.11ax) is an important evolution
of the Wi-Fi standard to meet the low power,
performance, security and interoperability
requirements needed in environments with
hundreds or thousands of connected IoT
devices and Redpine’s technology will help
accelerate Silicon Labs’ roadmap for Wi-Fi
6 silicon, software and solutions. The
acquisition also includes Bluetooth Classic IP
for audio applications.
Editor Neil Tyler
neil.tyler@markallengroup.com
Deputy Editor Elliot Mulley-Goodbarne
Elliot.Mulley-Goodbarne@
markallengroup.com
Contributing Chris Edwards, Charlotte Hathway,
Editors John Walko
editor@newelectronics.co.uk
Art Editor Andrew Ganassin
andrew.ganassin@markallengroup.com
Illustrator Phil Holmes
Sales Manager James Creber
james.creber@markallengroup.com
Publisher Peter Ring
peter.ring@markallengroup.com
Managing Jon Benson
Director jon.benson@markallengroup.com
Production Nicki McKenna
Manager nicki.mckenna@markallengroup.com
New Electronics editorial advisory panel
Trevor Cross, chief technology officer, Teledyne e2v
Pete Leonard, electronics design manager, Renishaw
Pete Lomas, director of engineering, Norcott Technologies
Neil Riddiford, principal electronics engineer, Cambridge
Consultants
Adam Taylor, embedded systems consultant
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