lens, automotive parts, medical,
glass, and MEMS industries use this
sensor technology in a variety of ways.
This innovative measuring equipment
for electronics manufacturing,
and much more besides, can be
discovered, discussed and evaluated
on the Micro Epsilon stand.
OKW recently launched two new
adapters that enable any small
plastic enclosures to be mounted
direct onto a DIN rail – saving
space and signi cantly speeding up
installation. Suitable for a wide range
of electronics applications, theses
adapters are designed to t the
popular TH35, TH15 and G32 DIN
rails.
OKW offers a wide range of DIN rail
enclosure accessories and options
which can be examined and discussed
on the company’s stand.
Pico Technology has released a
new BroadR-Reach decoder/analyzer
package that simpli es Automotive
Ethernet integration testing and
debugging. The package includes
a novel non-intrusive Software
Directional Coupler to separate up-
and downstream traf c on full-duplex
communication lines, and electronics
designers will be able to see this
SHOW PREVIEW PCB DESIGN &
MANUFACTURING LIVE 2020
Workshop programme Free-to-attend workshops hosted throughout the day
9.30am Manage SI/PI, DFM, DFA
and DFT in the Design Cycle to
Prevent Costly Re-Spins
Room: Lecture Room 1
Andrew Windscheffel, EMEA AE
Director, Cadence Design Systems
PCB layout tends to suffer the same
design cycle – which is layout the
PCB without enough rules to check
the full fabrication, assembly and SI/
PI performance. This leads to costly
re-spins – costly in time to market and
the nancial cost of a physical PCB that
does not perform well. In this workshop
you will be shown how improving the
way we design by understanding SI/
PI needs, fabrications needs and rules,
assembly needs, and how we can turn
those needs into real time Design Rules
can help to cut out costly re-spins,
which then improves time to market
and removes costly re-spins of the PCB.
10.30 Why Thermal Simulation is a
Must for Electronics Design
Room: Lecture Room 1
Matt Evans, Product Engineer,
6SigmaET by Future Facilities
There are so many things to consider
when designing a PCB, from signal
integrity to design for manufacture.
Thermal management can, however,
often get forgotten about and left to
the last minute.
In this workshop you will learn
how to use thermal simulation to
identify thermal issues early in the
design process. You will discover how
to import PCB designs from your EDA
software in to a 6SigmaET thermal
simulation, how to accurately model
components on your board and how
to use simulation results to improve a
systems thermal management. Using
simulation helps you eliminate thermal
issues and streamline your design
process.
11.30 Effective Methods for
Advanced Routing
Room: Lecture Room 1
Tony Folan, senior eld application
12.30pm How to Maximise PCB
Space with Connector Selection
Room: Lecture Room 1
Neil Moore, Product Manager – EMC
Boardware & Industrial Connectors,
Harwin
Connectors are often the last
components considered during
PCB design, yet they account for a
considerable amount of PCB space and
a large percentage of the overall B.O.M.
value. When speci ed in the right way,
the resulting saving in PCB space can
be signi cant.
This workshop will investigate the
common connector selection mistakes
and how they can be avoided, as well
as providing practical tips on selecting
the right connector for the job.
1.30pm PCB Tools & Resources for
Design Engineers
Room: Lecture Room 1
Maurice Banting, Head of Design
Software and Tools - DesignSpark, RS
Components
Through experience, we understand
how a lack of access to design tools
creates engineering bottlenecks
and project delays. We know rapid
prototyping, accuracy and design
ef ciency are key and so we’ve
introduced professional level design
software, free for all design engineers.
Enhancing the experience, engineers
can also discover CAD neutral libraries,
reference designs, articles, comments,
new product reviews, learning material
and many other resources.
Further support is provided through
FAQs and the forum, a place to talk to
fellow engineers. In this session, we’ll
share how these tools are available
today through DesignSpark, your go-to
design engineering platform.
latest advance, and other offerings in
the Pico Technology portfolio.
engineer, Altium UK
To be effective when routing dense,
intricate designs, powerful interactive
software with high levels of automation
can make the task faster and painless,
as long as the designer still has control.
Topics discussed in this session will
include setting up fanouts for easier
routing, use of design rules to ful l
routing requirements, high-speed
concerns, and route quality. You will
also learn about advanced routing
techniques and new developments,
which will signi cantly improve
productivity and quality.
www.newelectronics.co.uk 25 February 2020 25
/www.newelectronics.co.uk