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Peak performance
To power-up the fast-growing fleet of hybrid and fully electric vehicles, a power
module technology platform has been developed for e-mobility traction applications
The DCM 1000 platform delivers the highest power rating on the market enabled by winning technologies such as DBB®, ShowerPower®3D and unique transfer molding
With the increased focus on
reducing the global CO
footprint, automotive Tier-1s and
OEMs are incentivized to optimize
electric drivetrain technology to
supply the growing demand for
attractive and a ordable EVs and
HEVs. The key to achieving this is
maximizing the ability and
e iciency of power semiconductors.
Performance of the electric
drivetrain rests on the inverter’s
ability to transfer energy from the
battery to the motor, so greater
battery power utilization and
therefore higher e iciency can
contribute to increasing the driving
range of electric and hybrid
vehicles, making it an attractive
option for end-users.
The vehicle’s main inverter is
power module based, utilizing Si
or SiC semiconductors, so for
enhanced drivetrain performance,
the power module must deliver
higher power density. With
semiconductors dominating the
overall cost of a power module,
it is in the economic interest of
developers to achieve the highest
e ect with the smallest
semiconductor area.
With decades of experience,
Danfoss has helped the world’s
leading automotive OEMs and
Tier-1s to deliver solutions designed
to meet stringent e iciency,
reliability and cost targets that
ultimately lower the overall cost
of the system. To meet the industry
demand for inverter solutions that
deliver higher power density, easy
integration and cost-e ectiveness,
Danfoss introduced its DCM 1000
technology platform for e-mobility
traction applications.
The platform is based on a
number of patented technologies,
which enable the power module
to fully exploit the capacity of the
semiconductor. Years of research
and development in material
science, bonding and joining
technology, as well as thermal
management of the electrical
components has enabled higher
power density, while reducing
the amount of Si or SiC used.
166 // July 2019 // www.electrichybridvehicletechnology.com
The technologies developed
by Danfoss include silver-sintered,
copper-based bonding and joining
techniques, smart thermal
management with direct liquid
cooling, and the solid packaging
of the module with transfer molding
combined with a puzzled leadframe.
The puzzled leadframe enables the
connection of two di erent types
of materials, so developers can weld
the load connectors of the power
module onto the busbar and press
signal connectors into the circuit
board. In combination, these
technologies increase the current
carrying capabilities of the module,
while also ensuring thermal and
mechanical robustness.
In the same package, power
can be scaled up or down to meet
di erent BEV and HEV inverter
voltage classes with blocking
voltages of 750V-1200V, while
having di erent output current
classes from 350A-650A. This
cost-e ective solution means the
same mechanical design can be
used throughout, while scaling
it to meet the di erent voltage
classes used in the application.
The DCM 1000 technology
platform is chip independent,
allowing for flexible selection of
a wide range of suppliers of IGBTs,
diodes and MOSFETs, which
ensures ideal semiconductor as well
as ensuring an optimized cost and
supply security through multiple
sources on chip level.
To reach a series-qualified and
reliable platform, the DCM 1000
has been tested to validate design
calculations, to prove output current
performance as well as thermal
behavior during system/inverter
operation, but also to investigate
switching and conduction losses.
Results have proven the targeted
output performance is achieved,
allowing automotive drivetrain
applications to fully utilize the
power semiconductors without
any derating.
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To learn more about Danfoss, visit:
www.magupdate.co.uk/PEHV
/www.electrichybridvehicletechnology.com
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